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In this issue, we are thrilled to welcome not only our newest industry collaborator
– the Semiconductor Industry Association (SIA), we are also excited to
welcome and work with our newest editorial panel members, Dr. Dan Edelstein,
IBM Fellow and Manager of BEOL technology Strategy at IBM, Dr. William Chen
Senior technical advisor at Advanced Semiconductor Engineering (ASE) and Dr.
Pushkar Apte, Vice President of Technical Programs at SIA. We look forward to
their direction and insight.
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In this issue:
Future Visions & Current Concerns
Gartner presents Part 1 of a paper about the future of foundries, examining trends that are driving changes in the market and Part 2 of The Emergence of Bionanotechnology, which takes a look at the electronic and photonic components that detect and measure a wide variety of biological materials (bio-analytes).
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New Technologies & Device Structures
A look at novel lighting devices that utilize flexible electronics for electronic textile applications an in Part 2 of Silicon Nanophotonics, the article looks at the challenges this new technology faces in making it to the market.
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Design Implementation & Process Integration
A look at the issues associated with the troubled methodology of SoC design and a discussion on why a new predictable approach is required and an article that introduces a new concept that offers chip makers a method for leveraging variability to build chips that perform faster or on lower power or both, called “elastic clocking.”
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Manufacturing, Systems & Software
A case study looking at a new method to upgrade an existing fab automation system, successfully helping fab operations improve process equipment utilization, without interruption of production or the existing automation.
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Front End of Line
An article looking at a figure of merit that has been designed to measure true photoresist progress.
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Back End of Line
An article highlighting the comparison of the resistance of singled-walled carbon nanotubes with that of copper nanowires.
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Metrology, Inspection & Failure Analysis
Part 2 of a paper that describes the use of Xitronix’s photo-reflectance technique for the in-line characterization of strain and USJ dopant activation in advanced FEOL processing and a study that explores the use of scatterometry for characterizing fin profile, as well as high-k gate dielectric and metal gate thickness variation.
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Wafer Fab & Packaging Integration
Conformal, uniform and adherent nanometric layers: a closer look at E3’s fundamental characteristics and a revolutionary look at thin chips for 3D-TSV at ultralow cost.
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Assembly, Test & Packaging Technologies
A look at how structural test using DfT in the IC design can help limit excessive yield loss, and more. This article describes how the new methods have been developed to diagnose “undiagnosable faults” and a look at, electromigration reliability of various flip-chip solder joint systems, including different substrate pad finishes and solder compositions, is summarized to demonstrate the effect of the Cu content.
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Advances in Process Quartzware Cleaning
This document describes the initial test and evaluation results obtained at International SEMATECH on the QCS 2000TM quartz cleaning system manufactured by QCS Global. Two important considerations in effective quartz cleaning are the chemistry and the application method. Initial testing of the QCS 2000TM’s spray capability to clean quartzware with film deposits of polysilicon and nitride indicates that it cleans more efficiently than immersion-type cleaning equipment.
Future Fab Intl.Volume 15, 7/11/2003
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