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According to market experts, the thin
wafer market will grow 3 to 30 percent by
2007. This growth is fueled in large part by
the ability of thin wafer technology to allow
staked packaging for the IT industry and
significantly improved power dissipation for
power devices – a critical requirement for
reducing die size. Thin wafer technology
increases the function density of IC packaging
to enable the development of more
portable electronics. To ensure rapid growth
of the thin wafer market, the semiconductor
industry requires a new method for highquality,
low-cost wafer dicing. Synova SA
has developed a water-jet-guided laser
wafer dicing system to meet this need. The first process of semiconductor device
assembly is wafer dicing. Most semiconductor
wafers in use today are composed of
silicon. Silicon wafers are cut from single
crystal silicon ingots. Diamond is a diamond
cubic crystal structure formed by two
face center cubic structures, which is the
hardest material in the world (on the Mohs
Hardness Scale, diamond measures 10 and
silicon measures scaled 7 [1]). Diamond
saws have thus been used for more than 30
years in silicon wafer dicing and mass semiconductor
device assembly production.
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