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 In 1998 the Joint Venture Semiconductor
300 (Infineon/Motorola) installed the
world’s first 300 mm Pilotline at the existing
Infineon Dresden facilities. The goal of this
JV was to prove 300mm readiness for tool
and process, automation and
manufacturing. After the first product
qualification in 99 and a fast ramp yield
more than 10 million DRAMs (64M, 128M)
have been shipped from this pilotline to the
customer. For this 300mm breakthrough,
SEMI’s Fab of the year award 2000 went to
Semiconductor 300.
The Start Up phase of a new fab lasts from the final stage of construction/
infrastructure until the installation of the first and the back up toolset. Due to the complexity and the interdependence of concurrent systems and activities, this phase is normally a major challenge, even in a classical 200mm environment. For 300mm the complexity increases. There are additional built in strong links between construction, automation, hook up and equipment.
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