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Icebergs by themselves aren’t bad or
good – they just are. The important part is
knowing what’s under the surface and
what impact that can have, whether it’s a
physical structure, a complex control system,
or an observed behavioral phenomenon.
It is much the same with the
advanced process control (APC) segment
of the semiconductor manufacturing
industry at this moment. This article highlights
a number of the major technical
and business issues facing the industry
and goes beneath the surface to explain
the deeper forces at work. Specifically,
it will dive into the topics of data, standards,
market structure and end user
application development. A number of leading-edge users have
pointed out that the current generation of
production semiconductor APC technologies
will soon run out of steam – and this
is especially true of the statistically based
algorithms prevalent in most fault
detection/classification (FDC) systems.
The continued evolution of run-to-run
control (R2R) and FDC applications
capability depends on the use of increasing
amounts of product, process, equipment
and sensor data; however, the state
of the practice in today’s process data
collection and management systems is a
serious limitation.
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