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Efforts to achieve functional and cost-effective operational interfaces for 300mm wafer fabs began in the mid-1990s through the collective efforts of device manufacturers’ participation in the International 300mm Initiative (I300I), Japan 300mm Working Group (J300), Semiconductor Leading Edge Technologies (SELETE), and International SEMATECH. The goal was to define common requirements and guidelines for integration of fab production tools and automation systems. This joint effort was followed up with equipment suppliers and device maker representatives’ work in creating a new set of 300mm SEMI standards to be used in defining industry-standard equipment design requirements. While much effort has been expended to put guidance publications and SEMI standards in place which project a logistics infrastructure ‘model’ for the fully automated 300mm fab, it is widely recognized that the implementation of the new logistics infrastructure is a much larger undertaking. This undertaking at each 300mm fab requires coordinated efforts by equipment suppliers, control systems suppliers, facilities contractors, and device maker staffs.
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