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When is a conversion not a conversion? Texas Instruments DMOS6 wafer fab was designed and constructed in the mid- 1990s as a 200mm Megafab, the business and technology climate suggesting that its capacity would be required in advance of 300mm production becoming viable. DMOS6 was conceived, designed, and built in the heyday of wafer fab expansion. The design was a culmination of the collective experience of TI’s internal Worldwide Construction team (part of TI Worldwide Facilities), technology experts from various internal organizations, and resources from external design and construction partners. DMOS6 was designed to be a flexible, extendable, state of the art 200mm fab.
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