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The Extensibility Of Optical Patterning Via Directed Self-Assembly Of Nano-Engineered Imaging Materials
(1/12/2005) Future Fab Intl. Issue 18
By Daniel J.C. Herr, Semiconductor Research Corporation
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How far can we extend optical patterning? At the November 1992 Semiconductor Technology Workshop, the demise of optical patterning was projected to occur in 2001, after the 180 nm technology node. This corresponded to nine years or three technology nodes, n+3, out from the then-current 500 nm technology node, n. The 1994 and 1997 National Technology Roadmaps for Semiconductors (NTRS) conveyed similar messages, that optical lithography would end after the 130 nm and 100 nm generations, respectively, or n+3 nodes out from the current technology nodes.

During this period, considerable attention was focused on the exposure tool and mask infrastructure. The cost of bringing each exposure tool technology to market is on the order of $1 billion dollars. The corresponding development of a robust mask fabrication infrastructure is within an order of magnitude of the exposure tool costs.

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