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SECTION 8: INTRODUCTION
(1/12/2005) Future Fab Intl. Issue 18
By Alain C. Diebold, College of Nanoscale Science and Engineering, University at Albany
Christian Boit, Berlin University of Technology, Germany
Ehrenfried Zschech, Fraunhofer IZM (et al.)
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Metrology and physical failure analysis are essential for process control,
for yield improvement and for the necessary product reliability. Particularly,
yield-limiting process excursions and reliability-related failures have to be
excluded during the manufacturing process. This edition of Future Fab
International presents two papers on metrology for wafer manufacturing. We
look at applications for the combined use of focused ion beam (FIB)/ scanning
electron microscope (SEM) techniques and at monitoring of the selective
epitaxial growth process using haze light scattering and spectroscopic
ellipsometry (SE) measurements on monitor and product wafers, respectively.
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