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Back in the July 1997 issue of Future Fab
International, Bob McDonald and I published an
article on “The At-Line Characterization
Laboratory of the ’90s.” After the ITRS and
Semicon Europa meetings, I visited Ehrenfried
Zschech at AMD in Dresden. AMD is continuing
this trend with what might be called the FABLAB
of the early 2000s. AMD’s FABLAB has 300 mm
capable characterization equipment, software to
aid in navigation to specific locations on the
wafer, and advanced microscopy. This lab
serves as a shining example of how important it
is to tie the LAB to the FAB. Laurens Kwakman
of Philips gave a great presentation on the 300
mm Laboratory of the Crolles2 Alliance at the
2005 Characterization and Metrology for ULSI
Technology Conference. Sematech once again
cosponsored this conference. One of the most important activities done in
a FABLAB is selection and evaluation of equipment
that moves from the lab to the fab.
Because the expertise in materials characterization
is essential to understanding advantages
and limitations, applications development and
equipment shake-down are accelerated.
Furthermore, this know-how can be extended between organizations promoting the teams
necessary for successful implementation in the
clean room. Across the industry there are some
well-known examples of how this approach
brings needed capability into the fab. Dual-beam
FIB and X-ray reflectivity are examples of this.
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