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SECTION 8 – INTRODUCTION: METROLOGY/FAILURE ANALYSIS
(1/7/2006) Future Fab Intl. Issue 20
By Alain C. Diebold, College of Nanoscale Science and Engineering, University at Albany
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The 2005 Metrology Roadmap was released in December along with the entire International Technology Roadmap for Semiconductors. Once again, measurement specialists from all the semiconductor-producing regions provided key assessments of the status of existing measurement technology and projected future requirements and potential solutions. The ITRS projects the year of volume production for the first two companies manufacturing qualified chips. A qualified chip is one approved by its customer. One of the frequently forgotten needs is for early versions of a process or production worthy measurement system for the next technology generation three years beforehand. Process tool development occurs a number of years before the Alpha tool is sent to an IC manufacturer. Some form of metrology must be ready to support the development of new materials, structures and process tools. The moral of this story is that alpha, beta and production tools are needed long before the date associated with a technology node. Therefore, research and development for the 45/32nm node metrology needs should be well underway in 2006. Research into measurement methods for the 22nm node should be (or has already been) initiated. As has been frequently stated, the biggest inhibition for metrology research is the availability of materials and structures for future technology generations.

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