In this issue:
Special Introduction
 Special Introduction :: Download the new issue now!
Welcome to this special issue of FFI focused on the revised ITRS. Since the 2009 ITRS is a dynamic document, you will find many exciting new ideas and improvements as compared with the 2007 ITRS version.
Paolo Gargini, Intel Corporation
Future Visions & Current Concerns
INTRODUCTION: Future Visions and Current Concerns :: Download the new issue now!
For 2009, the ITRS team had set itself the task of thoroughly reviewing and revising the entire Roadmap, especially in view of the growing importance of heterogeneous integration.
Gilbert Declerck, IMEC
Environment, Safety & Health :: Download the new issue now!
A look at the significant new element that was added to the 2009 ESH Roadmap, and why it was needed.
Michael Mocella, DuPont Electronic Technologies
RF and A/MS Technologies for Wireless Communications :: Download the new issue now!
A paper that discusses the scope, the updates, the key considerations and the challenges ahead for the radio frequency and analog/mixed signal area.
Herbert S. Bennett, National Institute of Standards and Technology, John J. Pekarik, International Business Machines Corporation, Margaret Huang, Freescale Semiconductor
New Technologies & Device Structures
INTRODUCTION: New Technologies & Device Structures :: Download the new issue now!
The fact that the semiconductor industry has an instrument such as the ITRS is an invaluable asset. Certainly in times when the industry faces tremendous technical and manufacturing challenges, the ITRS can focus its worldwide resources on a limited number of solutions. In that way, our limited resources are used in the most efficient way.
John Schmitz, NXP Semiconductors
Profile: Hitachi :: Download the new issue now!
Hitachi High Technologies America, Inc.
Emerging Research Devices :: Download the new issue now!
A look at logic and information processing technologies, memory technologies and architectures for the Emerging Research Devices Chapter of the ITRS.
James A. Hutchby, Semiconductor Research Corporation
Profile: Matheson Tri-Gas :: Download the new issue now!
Matheson Tri-Gas Business Development, Matheson Tri-Gas
Emerging Research Materials :: Download the new issue now!
A brief survey of the current set of Emerging Research Materials that exhibit properties compatible with TWG-identified application needs.
C. Michael Garner, Intel Corporation, Daniel J.C. Herr, Semiconductor Research Corporation, Yuji Awano, Keio University
Design Implementation & Process Integration
INTRODUCTION: Design Implementation & Process Integration :: Download the new issue now!
The proclamation "make things as simple as possible ... but no simpler" seems relevant in light of the next two articles. While design needs have always stretched the current boundaries of the day, today there is truly less headroom for suboptimal designs.
Steven E. Schulz, Silicon Integration Initiative, Inc.
Profile: Synopsys :: Download the new issue now!
Synopsys
Modeling & Simulation :: Download the new issue now!
A paper describing the changes compared to the 2008 chapter, as well as difficult and long-term challenges for the Modeling & Simulation chapter of the ITRS.
Jürgen Lorenz, Fraunhofer Institute of Integrated Systems and Device Technology (IISB)
Profile: Atrenta :: Download the new issue now!
Atrenta Business Development, Atrenta
Design and System Drivers :: Download the new issue now!
A look at the challenges and required solutions, as well as the new aspects, in the Design and System Drivers Chapters of the 2009 ITRS.
Juan-Antonio Carballo, IBM VC Group, Andrew B. Kahng, University of California, San Diego
Manufacturing Systems & Software
INTRODUCTION: Manufacturing, Systems & Software :: Download the new issue now!
For semiconductor industries, the main "driver" is Moore's law. The pursuit of Moore's Law in reducing costs of silicon devices presents many challenges to the semiconductor industry manufacturer through ever-smaller device dimensions while also increasing functionality.
Giuseppe Fazio, Numonyx
Profile: UMC :: Download the new issue now!
UMC
Process Integration, Devices, & Structures :: Download the new issue now!
A review of the scope, difficult challenges, as well as such aspects as logic, memory and reliability within the Process Integration, Devices, & Structures Chapter of the ITRS.
Kwok Ng, Semiconductor Research Corporation, Hidekazu Oda, Renesas Technology Corp., Kin P. Cheung, National Institute of Standards and Technology
Factory Integration :: Download the new issue now!
A look at the scope, activity, challenges and 2009 highlights of the Factory Integration Chapter of the ITRS.
Shigeru Kobayashi, Renesas Technology Corp.
Front End of Line
INTRODUCTION: Front End of Line :: Download the new issue now!
In this Front End of Line section, we have a first look at the 2009 ITRS lithography and front end technology materials; good summaries to get us a quick outlook for the next few years.
John Schmitz, NXP Semiconductors
Profile: Nikon :: Download the new issue now!
Nikon Corporation
Lithography :: Download the new issue now!
A paper that details the cost of ownership and describes the difficult challenges regarding the Lithography Chapter of the ITRS.
Greg Hughes, SEMATECH
Profile: SAFC Hitech :: Download the new issue now!
SAFC Hitech
Front End Processes :: Download the new issue now!
A forecast of scaling-driven technology requirements and potential solutions is provided for each of the technology areas in the FEP chapter of the ITRS.
Jeffery W. Butterbaugh, FSI International, Lawrence Larson, Texas State University at San Marcos, TX, Raj Jammy, SEMATECH
Back End of Line
INTRODUCTION: Back End of Line :: Download the new issue now!
It is a pleasure to provide an introduction for Christopher Case and his summary of the ITRS Interconnect Chapter. I look forward to reading the Chapter!
Dr Jeffrey T. Wetzel, SVTC Technologies, LLC
Profile: TEL :: Download the new issue now!
Tokyo Electron (TEL)
Interconnect :: Download the new issue now!
A paper detailing the scope, what's new, the highlights of selected process modules, the emerging area, as well as architecture and 3D aspects dealing with the Interconnect Chapter of the ITRS.
Christopher Case, Solid State Solutions
Metrology, Inspection & Failure Analysis
INTRODUCTION: Metrology, Inspection & Failure Analysis :: Download the new issue now!
In-line metrology and defect inspection are essential for process control, yield enhancement and product reliability. Particularly, yield-limiting process excursions and reliability-related failures have to be excluded during the manufacturing process.
Ehrenfried Zschech, Fraunhofer Institute for Nondestructive Testing; Dresden
INTRODUCTION: Metrology, Inspection & Failure Analysis :: Download the new issue now!
Engineers often run the risk of being caught in a whirlwind of actions that might seem simply temporally juxtaposed to one another without a common logical thread.
Davide A. Lodi, Numonyx
Profile: Entegris – Specialty Materials Division :: Download the new issue now!
Entegris Business Development, Entegris – Specialty Materials Division
Yield Enhancement :: Download the new issue now!
An overview of the 2009 Yield Enhancement chapter of the ITRS that additionally describes some of the key challenges and solutions needed.
Dilip Patel, ISMI/SEMATECH
Profile: Semilab AMS :: Download the new issue now!
Semilab AMS Business Development, Semilab AMS
Metrology :: Download the new issue now!
An article that reviews the measurement requirements and potential solutions that accelerate the push for introduction of advanced lithography, front end and interconnect processes. It additionally reviews the advances and describes the gaps in capability regarding beyond-CMOS materials and devices measurements.
Alain C. Diebold, College of Nanoscale Science and Engineering, University at Albany
Assembly Test & Packaging Technologies
INTRODUCTION: Assembly Test & Packaging Technologies :: Download the new issue now!
The ITRS has been repeating the mantra “More than Moore” for the last couple of years and pursuing ways to show the avenues that will make it happen. One of the main methods through which this will happen is by going vertical (Z-Axis) with the packaging.
Steve Greathouse, Plexus Corporation
Profile: Advantest :: Download the new issue now!
Advantest
Test & Test Equipment :: Download the new issue now!
A look at the most significant updates to the ITRS Test chapter, including 3D silicon devices, adaptive test and a summary of the key findings of a cost of test survey.
Roger Barth, Numonyx
Assembly & Packaging :: Download the new issue now!
This paper overviews the changes that occurred for the Assembly & Packaging Chapter since the 2008 Roadmap, specifically involving System in Package, 3D Integration, Wafer-Level Packaging, MEMS, Optical Devices and Automotive Electronics.
W. R. Bottoms, Third Millennium Test Solutions, Inc.
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