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April Edition - AVAILABLE NOW! |
Why 450 mm? Reduce manufacturing cost, stimulate another wave of innovation on equipment and manufacturing methods, and drive toward greener manufacturing. Semiconductor manufacturing costs have increased rapidly as technology complexity has accelerated at sub-20 nm nodes. Process steps… have added costs. Evolving technology drives the need for periodic wafer size increases to maintain historical cost reduction trends.
John Lin, Paul Farrar, G450C
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In this issue:
Future Visions & Current Concerns
What has been true for the evolution of the animal kingdom has never been truer for the evolution of the nanoelectronics kingdom as well. As scaling of devices has been enabled by the development of new materials and fabrication techniques, increased cost-effectiveness of semiconductor manufacturing has been realized in part by the increase of wafer size.
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New Technologies & Device Structures
The two papers in this section talk about widely differing applications: flexible displays and 10-axis M&NEMS sensors. The common ground, though, is that both are based on new technologies that have been refined and optimized in R&D labs for a long time, and that are now transferred for actual fabrication.
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Lithography Landscape
Additional mask data preparation, called mask process correction (MPC), is required prior to mask exposure. But where should the correction be performed in the mask data flow?
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Back End of Line
The paper in this Back End of Line section addresses one of the most critical challenges our industry has ever faced. This is not an overstatement, but it is only recently that the severity of this challenge has been fully recognized.
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Metrology, Inspection & Failure Analysis
This issue’s MIFA section deals with two main topics: A general overview of technical requirements for a future viable metrology (either for 450 mm or to cope with challenges imposed by a 1X nm technology node) is paired with a specific case study of a typical, day-to-day defectivity problem.
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Wafer Fab & Packaging Integration
First of all, I must admit that I don´t like the naming “2.5D” for interposer technology; for a physicist, 2.5D is an outrageous term. On the other hand, as a technologist, I surely see advantages of interposers against “real” 3D integration: less complex design flow and testing, better thermal management—and potentially lower cost.
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A Question of Picoseconds! Advantest E1381A, an E-Beam Test Solution for 0.13µm
Future Fab Intl.Volume 10, 7/1/2001
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