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April Edition - AVAILABLE NOW! |
Welcome to the April 2009 issue of Future Fab. With this issue, we are pleased to officially welcome our newest partner, the Global Semiconductor Alliance (GSA). We’re excited to be working with them.
With all of the negative press that continues to bombard the news, Internet and our industry, we are only too pleased to offer you a break from it all. Here in our 29th issue of Future Fab, we present to you more unbiased, leading-edge and thought-provoking technical papers, from some of the most influential organizations globally. We hope you will find this issue both interesting and informative.
Enjoy!
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In this issue:
Future Visions & Current Concerns
Over the last several years, our industry has been significantly transformed. The way we now do business is dramatically different than the way we did business 20 or 30 years ago. - Stephen Buffat
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New Technologies & Device Structures
Companies, research centers and universities active in microelectronics are all facing the headwinds of a –
to put it mildly – challenging operating environment. Most believe that the way forward is in relentless
innovation – innovation that is taking into account the challenges of the 21st century: the quest for sustain
able energy generation, affordable and better healthcare, and an information and communication infrastructure for everyone. - Lode Lauwers
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Design Implementation & Process Integration
Today there is no limitation in the demands to integrate more and
more functions on a semiconductor chip. Moore’s Law has supported this advance for decades.
- Kazu Yamada
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Manufacturing, Systems & Software
The challenges facing the semiconductor industry are considerable and include
both the technological and the economic. As has always been the case, the two are intertwined.
- Tom Sonderman
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Front End of Line
Spring is here. In our fond memories of springs past, designers would pull out their
Moore’s Law calculators, with their single “0.7x” button, to define patterning requirements
for the next node. Stepper designers would grow the lens numerical aperture to an “impossible” 0.54,
process engineers would tweak the resist and etch processes, and the job would be done.
- Janice Golda
Continued dimensional scaling will require either EUV lithography (very promising, yet still very challenging) or getting more from the available optical scanners, most likely with multiple exposures.
- John Warlaumont
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Back End of Line
Two scaling trends have fueled the last several decades of the information age, which have followed a phenomenal, super-exponential growth in digital computing power per unit cost, per unit device area and per unit calculation time. These are Moore’s Law and Dennard Scaling, which respectively describe increases in integrated circuit density and CMOS circuit speed with continued miniaturization of the circuit elements. Both of these trends are beginning to saturate, as they are being impacted by several physical and practical barriers.
- Dan Edelstein
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Wafer Fab & Packaging Integration
“There is only an inch of water needed beyond the bottom of a ship.” These words could be translated into thin silicon technology: “There is only a micron of silicon needed beyond the active layers.”
- Peter Ramm
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Assembly Test & Packaging Technologies
Many companies in the industry are carefully husbanding their resources for investment in research and development, in preparation for inevitable economic upturn and market resurgence. In recent years, there have been great advancements in innovation and invention of electronics products, largely driven by the imperatives of the expanding consumer market.
- William Chen
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China – Challenge, Opportunity and Reality
The potential size of the Chinese market place, for semiconductor and electronics related products, is huge.
Future Fab Intl.Volume 12, 2/2/2002
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