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A dramatic increase in the signal to noise ratio can be achieved by employing a mathematical procedure called Principle Component Analysis (PCA)[4]. In PCA, the observed variables are reduced to a smaller number of principle components that will account for most of the variance…
Frieder H. Baumann, IBM Micorelectronics
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In this issue:
Future Visions & Current Concerns
“The best way to predict the future,” it has been said, “is to invent it.” Such is the case with manufacturing, which relies on ongoing innovation to enable advancements in reliability, efficiency and cost.
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Chip Architecture & Integration
One of the key lessons from the industrial revolution was that standardization enables markets to grow at explosive rates. Standardization radically altered the landscape of transportation (standard railroad gauges), warfare (interchangeable parts in Winchester rifles) and production (Henry Ford’s assembly line). Indeed, even the distribution method of electricity involved a pitched battle between Nicola Tesla (AC) and Thomas Edison (DC) as to what standard would be adopted for the power grid we still use today.
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Manufacturing: Fab, Systems & Software
In the design and implementation of manufacturing control systems, it can be said that there has been an appreciation for the need to understand the functionality to be delivered by those solutions. As continued development of factory automation progresses to more integrated and holistic fab solutions, however, there is commensurate need to understand the effect of a given solution on the overall manufacturing environment.
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Lithography Landscape
This article provides compelling indirect justification regarding the strategic need for new families patterning materials and processes that augment and extend current methods. The success of extensible and manufacturable nanopatterning depends on approaches that circumvent or compensate for current lithographic limitations. The path forward must navigate through the apparent trade-off in conventional top-down lithography between three critical and interdependent chemically amplified resist performance factors: resolution, throughput and line edge roughness.
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Front End of Line
Low-power consumer electronics require fast circuit operation for demanding applications with complex functionality and low-power consumption for long battery life.
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Metrology, Inspection & Failure Analysis
As integrated circuit features continue to shrink, interconnect lines, contacts and vias require characterization of the complete structure. Tomographic imaging provides a very useful means of viewing the 3D shape of these structures. Large features such as through silicon vias (TSVs) require X-ray methods.
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Wafer Fab & Packaging Integration
3D integration is much more than the drilling and filling of TSVs …
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Assembly, Test & Packaging Technologies
Electronic devices like smartphones and mobile devices require IC packages that are small and thin in order to meet consumer demands for more functionality within an increasingly limited space.
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A Simple Model of Line-Edge Roughness
An attempt to develop a comprehensive stochastic model for LER based on deriving approximate expressions for the variance and correlations that occur at each step in the lithography process.
Future Fab Intl.Volume 34, 7/14/2010
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