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January Edition - AVAILABLE NOW! |
Welcome to our first 2010 issue of Future Fab. We are pleased to be able to bring you our second annual ITRS Focus issue. Put together in close collaboration with the International Technology Roadmap for Semiconductors (ITRS), we are happy to present to you an overview of each of the Technology Working Groups (TWGs). We again have a special introduction from the Chair of the ITRS, one of our longest-standing Editorial Board members, Dr. Paolo Gargini, who formally introduces the ITRS content. And we are very pleased to be able to bring you a synopsis from each and every technology working group’s re-write with additional suggested reading and additional links. We hope that this issue helps you to understand the goals and the importance of the ITRS and that it helps you to obtain your goals.
Wishing you a successful 2010!
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In this issue:
Special Introduction
Welcome to this special issue of FFI focused on the revised ITRS. Since the 2009 ITRS is a dynamic document, you will find many exciting new ideas and improvements as compared with the 2007 ITRS version.
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Future Visions & Current Concerns
For 2009, the ITRS team had set itself the task of thoroughly reviewing and revising the entire Roadmap, especially in view of the growing importance of heterogeneous integration.
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New Technologies & Device Structures
The fact that the semiconductor industry has an instrument such as the ITRS is an invaluable asset. Certainly in times when the industry faces tremendous technical and manufacturing challenges, the ITRS can focus its worldwide resources on a limited number of solutions. In that way, our limited resources are used in the most efficient way.
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Design Implementation & Process Integration
The proclamation "make things as simple as possible ... but no simpler" seems relevant in light of the next two articles. While design needs have always stretched the current boundaries of the day, today there is truly less headroom for suboptimal designs.
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Manufacturing Systems & Software
For semiconductor industries, the main “driver” is Moore’s law. The pursuit of Moore’s Law in reducing costs of silicon devices presents many challenges to the semiconductor industry manufacturer through ever-smaller device dimensions while also increasing functionality.
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Front End of Line
In this Front End of Line section, we have a first look at the 2009 ITRS lithography and front end technology materials; good summaries to get us a quick outlook for the next few years.
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Back End of Line
It is a pleasure to provide an introduction for Christopher Case and his summary of the ITRS Interconnect Chapter. I look forward to reading the Chapter!
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Metrology, Inspection & Failure Analysis
In-line metrology and defect inspection are essential for process control, yield enhancement and product reliability. Particularly, yield-limiting process excursions and reliability-related failures have to be excluded during the manufacturing process.
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Assembly Test & Packaging Technologies
The ITRS has been repeating the mantra "More than Moore" for the last couple of years and pursuing ways to show the avenues that will make it happen. One of the main methods through which this will happen is by going vertical (Z-Axis) with the packaging.
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Current Status of Surface Wave Plasma Abatement of Semiconductor Global Warming Emissions
The effects of global warming on climate change have recently created intense interest and concern[1]. During the Third Conference of the Parties (COP3) held in December 1997 in Kyoto, Japan, 171 countries developed a treaty that will restrict emissions of the six most prominent greenhouse gases[2].
Future Fab Intl.Volume 11, 6/29/2001
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